深圳团聚金刚石磨料技术|半导体应用研磨抛光超硬材料

适用于蓝宝石加工，如LED芯片、窗口片、表镜片、手机指纹识别片、手机摄像头镜片等蓝宝石材料研磨；金属材料加工，如不锈钢、模具钢、钛合金及其它金属材料。
It is suitable for sapphire processing, such as the grinding of sapphire materials such as LED chips, windows, watch lenses, mobile phone fingerprint identification films, and mobile phone camera lenses. Processing of metal materials, such as stainless steel, die steel, titanium alloys and other metal materials.
用于硅片、蓝宝石、磁头、硬盘、硬质玻璃和晶体、陶瓷和硬质合金的超精密研磨和抛光。
as a precision abrasive,it is used for ultra-precision grindingand polishing of silicon wafers,sapphire,magneticheads,hard disks,hard glass and crystals,ceramics and hard alloys.

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